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Bare Die Bonded to PCB

1 byte added, 14:20, 22 August 2019
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Advantages:
Can be custom to each MMIC allowing a very short bond wire wires for RF pads
Wafer probe testing of MMIC is possible
Berk
90
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Retrieved from "https://wiki.ffo.indiesemi.com/wiki/Special:MobileDiff/1668"

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