600
edits
Changes
Jump to navigation
Jump to search
QFN
,no edit summary
__NUMBEREDHEADINGS__
Quad-flat no-lead (QFN) is one of the standard packaging technologies used in electronics. MMIC is wire bonded to a pre-produced lead frame. Then, the whole package is molded on top with plastic. Having 0.4mm to 0.6mm pitch, it is easy to handle for surface mount technologies (SMT) for assembly printed circuit boards (PCB). For more detailed information: [https://en.wikipedia.org/wiki/Quad_Flat_No-leads_package/wp/ Wikipedia - QFN]
RF signal loss due to long bond wires for RF pads
RF signal loss over the molding material for on -chip antenna versions
Since this technology is very well known and widely used around the globe, Silicon Radar is trying to keep its standard layouts even for other packaging technologies.
