LGA
Jump to navigation
Jump to search
Land Grid Array (LGA) is another standard technology for packaging MMICs. Instead of using a lead-frame as used in a QFN, a printed circuit board (PCB) is used as a base for the package. Chip is placed and wire bonded on the PCB base and molded on the top. Compared to QFN, LGA allows shorter bond wires and custom antenna designs on the package, because the base PCB can be designed accordingly.
Advantages:
Reliable, low cost and fast processing
Short RF bond wires possible
Suitable for QFN footprint
Disadvantages:
Not the best RF performance
Harder to solder on a PCB compared to lead-frame based packages