Changes

Flip chip is another method to evaluate the MMICs , as well as sample productions for small quantities. Solder bumps or stud bumps are placed on the pads of the MMIC. Then, MMIC is directly placed on the printed circuit boards (PCB), and soldered. This allows very short connection from pads of the chip to PCB; however pitch between pads must be kept 300-400um wide to fit the standard PCB technology requirements. This makes the MMIC bigger for complex designs.