Changes

Chip embedding with µ² technique is an advanced PCB-based technology. Rather than a standard printed circuit boards (PCB) technology with 50-100 um line and space, this technology allows down to 20 um line and space with very good tolerance. Accordingly, fine-tuned antenna structures can be designed. In addition to that, MMIC is buried into the PCB. Pads are connected to lines using copper pillars or gold stud bumps.

Advantages:

*Suitable for multi-chip modules with high-accuracy antennas on board

*Suitable for QFN footprint

Disadvantages:

*Very expensive and long lead times for prototyping

*Harder to solder on a PCB compared to lead-frame based packages