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Bare Die Bonded to PCB

1 byte removed, 09:52, 26 August 2019
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It is the simplest method to evaluate the MMICs as well as sample productions for small quantities. Chip is glued directly on the printed circuit board (PCB) with or without using a cavity. Then, gold or aluminium wire bonds are used to make the electrical connections from pads of the chip to the lines on the PCB. Optionally, a glop-top procedure can be applied to protect the chip and the wire bonds from damage.
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