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This page It is under constructionthe simplest method to evaluate the MMICs as well as sample productions for small quantities. We will come back Chip is glued directly on the printed circuit board (PCB) with more information soonor without using a cavity. Then, gold or aluminium wire bonds are used to make the electrical connections from pads of the chip to the lines on the PCB. Optionally, a glop-top procedure can be applied to protect the chip and the wire bonds from damage.
Thank you Disadvantages:Full chip functionality cannot be tested, since the MMIC is not in a package that is suitable for your patience.an industrial socketMMIC is not replaceable on the PCB Silicon Radar Support TeamNot suitable for series production
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Advantages:
Can be custom to each MMIC allowing a very short bond wire for RF pads
Wafer probe testing of MMIC is possible
